As integrated circuit (IC) feature sizes below a quarter micron scale, which defines the submicron (DSM) era, there began a gradual shift of the impact on performance because the metal interconnection between active circuit components. IC Interconnect Analysis methods include state-of-the-art for modeling and analyzing IC interconnect based on the last fifteen years of research. IC Interconnect Analysis begins with in-depth metrics of delay, including the ubiquitous Elmore delay and its many variations. IC Interconnect Analysis written for CAD tool developers, IC designers and graduate students.